Thermal Gel (Gap Filler)

One-Component Thermal Gel：
Thermal conductivity: 1.5 ~ 7.0 W/m·K
Naturally tacky surface, no need for adhesive backing
Low contact pressure, ideal for delicate components
Maintains surface wetness over time for stable interface
Easy integration with dispensing systems
UL94 V-0 flame retardant
Two-Component Thermal Gel
Thermal conductivity range: 1.5 ~ 5.0 W/m·K
Easy storage and long shelf life
Adjustable curing time based on temperature
Excellent mechanical & chemical stability at high and low temps
High reliability for long-term use
Flame retardancy: UL94 V-0
Compatible with automated dispensing & adjustable thickness

Thermal Gel (Gap Filler)

Ultra-soft, High Thermal Conductivity Silicone-Based Gap Fillers

Overview

TaxoTape® TX-TG Thermal Gel is a soft, conformable material engineered to fill microscopic gaps between heat-producing components and cooling surfaces, ensuring efficient heat transfer with minimal mechanical stress. Available in both one-component (non-curing) and two-component (curable) formulations, this material provides excellent thermal conductivity with minimal assembly pressure. Its ability to conform to complex geometries ensures consistent and reliable thermal transfer across multiple contact points—even under minimal mechanical load.

These gels can be applied using stencil printing, screen printing, or automated dispensing systems, making them ideal for high-volume automated production lines. Their non-slumping nature enhances precision during application and improves long-term performance.

One-Component Thermal Gel

Non-curing thermal interface material for low-pressure gap filling

Typical Applications

Flip-chip microprocessors

PPGAs / BGA / uBGA / DSP packages

LED lighting assemblies

High-power semiconductor devices

Circular accelerator chips

Two-Component Thermal Gel

Room-temperature or heat-curable AB formulation for automated dispensing

Typical Applications

Power electronics and semiconductors

Communication hardware

Automotive electronics

Shock-absorbing thermal interface designs

Heatsinks and PCB assemblies

Why Choose Our Thermal Gel Solutions?

Whether you need reworkable one-part materials or curable two-part compounds, our thermal gels offer the ideal balance of performance, reliability, and processing flexibility—tailored for today’s compact and high-power electronic devices.